MA4DP918-1277 Datasheet Hmictm Integrated Passive Diplexer Gsm/dcs / Amps/pcs

Manufacturer: Tyco Electronics (now TE Connectivity)

Overview: HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package V 1.

Datasheet Details

Part number	MA4DP918-1277
Manufacturer	Tyco Electronics (now TE Connectivity)
File Size	135.51 KB
Description	HMICTM Integrated Passive Diplexer GSM/DCS / AMPS/PCS
Datasheet	MA4DP918-1277_TycoElectronics.pdf

The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process.

HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium.

The glass allows HMIC devices to have excellent Q characteristics in a low profile, reliable device.

n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Required Low Cost Miniature Plastic MLP Package TM.

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