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MA4DP918-1277 - HMICTM Integrated Passive Diplexer GSM/DCS / AMPS/PCS

Description

The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process.

HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium.

Features

  • n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Required Low Cost Miniature Plastic MLP Package TM.

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Datasheet Details

Part number MA4DP918-1277
Manufacturer Tyco Electronics
File Size 135.51 KB
Description HMICTM Integrated Passive Diplexer GSM/DCS / AMPS/PCS
Datasheet download datasheet MA4DP918-1277 Datasheet
Additional preview pages of the MA4DP918-1277 datasheet.

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Full PDF Text Transcription

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HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package V 1.00 MA4DP918-1277 Features n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Required Low Cost Miniature Plastic MLP Package TM Description The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium.
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