MASW-000822-12770T Datasheet | Tyco Electronics

Key Features

• The device is provided in industry standard 3mm MLP plastic packaging
• This device incorporates a PIN diode die fabricated with M/A-’s patented Silicon-Glass HMICTM process
• This chip features two silicon pedestals embedded in a low loss, low dispersion glass
• The diodes are formed on the top of each pedestal
• The topside is fully encapsulated with silicon nitride and has an additional polymer passivation layer