MASW-000822-12770T
Description
The device is provided in industry standard 3mm MLP plastic packaging
Key Features
- The device is provided in industry standard 3mm MLP plastic packaging
- This device incorporates a PIN diode die fabricated with M/A-’s patented Silicon-Glass HMICTM process
- This chip features two silicon pedestals embedded in a low loss, low dispersion glass
- The diodes are formed on the top of each pedestal
- The topside is fully encapsulated with silicon nitride and has an additional polymer passivation layer