MASW6030G Datasheet | Tyco Electronics

Features - - - - Low Insertion Loss, 0.5 d B Typical Fast Switching Speed, 4 ns Typical Ultra Low DC Power Consumption Ro HS- pliant Description MA/’s MASW6030G is a Ga As MMIC DPDT switch die. The MASW6030G is ideally used where low power consumption is required. Typical applications include transmit / receive switching, switch matrices and switched filter banks, WLAN IEEE 802.11a and 802.11 b/g systems. Other applications include cordless phones and base stations. Ordering Information Part Number MASW6030G 1. Die quantity varies. Die Size - Inches (mm) Package DIE 1 0.048 x 0.038 x 0.010 (1.220 x 0.970 x 0.250) Bond Pad Dimensions 2,3 Bond Pad RF1, RF6 RF2, RF3, RF4, RF5, A, B GND Absolute Maximum Rating Parameter Control Value (A or B) Max Input RF Power Storage Temperature Max Operating Temperature Dimensions - Inches (mm) 0.005 x 0.005 (0.130 x 0.150) 0.004 x 0.004 (0.100 x 0.100) 0.005 x 0.013 (0.130 x 0.320) Absolute Maximum 0/-8 V +34 d Bm (0.5 - 6.0 GHz with 0/-8 V CTL) -65°C to +175°C +175°C Schematic 2. Exceeding any one or bination of these limits may cause permanent damage to this device. 3. M/A- does not remend sustained operation near these survivability limits. Truth Table 4,5 RF1 to RF6 to 1 0 RF2 On Off RF3 Off On RF4 On Off RF5 Off...