Datasheet Details
| Part number | MA4BPS301 |
|---|---|
| Manufacturer | Tyco Electronics (now TE Connectivity) |
| File Size | 83.95 KB |
| Description | PIN Diode Chips with Offset Bond Pads |
| Download | MA4BPS301 Download (PDF) |
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Overview: PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond.
| Part number | MA4BPS301 |
|---|---|
| Manufacturer | Tyco Electronics (now TE Connectivity) |
| File Size | 83.95 KB |
| Description | PIN Diode Chips with Offset Bond Pads |
| Download | MA4BPS301 Download (PDF) |
|
|
|
These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.
They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges.
The large pads allow use of multiple bond wires.
Compare MA4BPS301 distributor prices and check real-time stock availability from major suppliers. Prices and inventory may vary by region and order quantity.
| Part Number | Description |
|---|---|
| MA4BPS101 | PIN Diode Chips with Offset Bond Pads |
| MA4BPS201 | PIN Diode Chips with Offset Bond Pads |
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