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MA4SPS302 - Surface Mount Monolithic PIN Diode Chip

Datasheet Summary

Description

M/A-COM’s MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM’s patented HMIC™ process.

Features

  • Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Case Style ODS-12471, 2 A B.

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Datasheet Details

Part number MA4SPS302
Manufacturer Tyco
File Size 407.80 KB
Description Surface Mount Monolithic PIN Diode Chip
Datasheet download datasheet MA4SPS302 Datasheet
Additional preview pages of the MA4SPS302 datasheet.

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Full PDF Text Transcription

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MA4SPS302 SurMount™ Series Surface Mount Monolithic PIN Diode Chip Features • • • • • • • Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Case Style ODS-12471, 2 A B Description M/A-COM’s MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal side walls conductive. Selective backside metalization is applied producing a surface mount device.
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