MASW4030G
Key Features
- Cleanliness - The MASW4030G should be handled in a clean environment
- DO NOT attempt to clean unit after the MASW4030G is installed
- Static Sensitivity - All chip handling equipment and personnel should be DC grounded
- Transient - Avoid instrument and power supply transients while bias is applied to the MASW4030G
- Use shielded signal and bias cables to minimize inductive pick-up
- Bias - Apply voltage to either of the plementary control ports only when the other is grounded
- No port should be allowed to “float”
- General Handling - It is remended that the MASW4030G chip be handled along the long side of the die with a sharp pair of bent tweezers
- DO NOT touch the surface of the chip with fingers or tweezers
- MASW4030G V 2.00 Schematic Wire Bonding A
