UT12002
Features
: 1. Meets IEEE 802.3 and ANSI X.3.263 standards including 350u H OCL with 8m A bias. 2. Designed for reflow soldering at temperature 230±5o C. 3. pact footprint for use in the most space restrictive applications. 4. Turns Ratio tolerance: ±5% 5. Operating temperature: -40o C to +85o C Electrical Specification @25 o C : 1. Insertion Loss : -1.1d B Max. @ 0.10--100MHz. TX/RX 2. Return Loss : -20d B Min. @ 30MHz. TX/RX -14d B Min. @ 60MHz. TX/RX -11.5d B Min. @ 80MHz. TX/RX 3. Diff. to . Mode Rejection : -42d B Min. @ 30MHz. TX/RX -37d B Min. @ 60MHz. TX/RX -33d B Min. @ 100MHz. TX/RX 4. Cross Talk : -45d B Min. @ 30MHz. TX to RX -40d B Min. @ 60MHz. TX to RX -35d B Min. @ 100MHz. TX to RX. 5. HI-POT : 1500Vrms/2sec. Leakage Current 0.5m A Max./input to output.
REV. A3 02/42
Dimensions & Schematic:
Suggested pad layout
Coplanarity: 0.1mm
TRANSMIT 1 2 3 1CT:1CT RECEIVE 6 7 8 1CT:1CT 10 9 11 15 14 16
NOTE: 1. Packaging information-tape and reel according to item no. “SO16A” of data sheet...
