BZX84C3V9W Datasheet | UPM

Features - Planar Die construction - 200m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Both normal and Pb free product are available : - Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above Mechanical Data Case: SOT-323, Molded Plastic Terminals: Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Below Approx. Weight: 0.0052 grams Mounting Position: Any .087(2.2) .070(1.8) .054(1.35) .045(1.15) SOT-323 .056(1.40) .047(1.20) .004(.10)MAX. .006(.15) .002(.05) .044(1.1) .035(0.9) .016(.40) .078(.20) Dimensions in millimeters Maximum Ratings And Electrical Characteristics arameter Maximum Forward Voltage Drop at IF=10m A Power Dissipation (Notes A) at 25O Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load (JEDEC method) (Notes B) Operating Junction and Storage Temperature Range Symbo VF IFSM TJ alue 0.9 200 .0 -55 to +150 Uni t V m W Amp SINGLE NOTES: 1. Mounted on 5.0mm2(.013mm thick) land areas. 2. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum. 3. For Structure Purpose only. ( Note C ) Http://.upm..tw E -mail:upm.tw@msa.hinet.net BZX84C2V4W SERIES SURFACE MOUNT SILICON ZENER DIODES Voltage Range 2.4-39 Volts Power 200m Watts Part Number Marking Code Nominal Zener...