FR3B
Overview
- Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250oC/10 seconds at terminals Mechanical Data .083(2.11) .075(1.91) .185(4.70) .160(4.06)
- Case: molded plas body * Terminal: Solder plated * Polarity:Indicated by cathode band * Packing: 0.21mm grams .096(2.44) .083(2.13) .155(3.94) .130(3.30) .012(0.31) .006(0.15) .050(1.27) .030(0.76) .008 (.203) MAX. .220(5.59) .200(5.08) Dimensions in inches and (millimeters)
