UPM GLZ3.0
SURFACE MOUNT ZENER DIODES
| Part No. | GLZ3.0 |
|---|---|
| Datasheet | GLZ3.0 Download |
| Manufacturer |  UPM |
| Description | SURFACE MOUNT ZENER DIODES |
| Buy | Stock & Price |
FEATURES
* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA.MECHANICAL DATA
Case: Molded Glass MINI-MELF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.03 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel .020(0.5) .012(0.3) .146(3.7) .130(3.3) .020(0.5) .012(0.3) Dimensions in millimetersMAXIMUM RATINGS
andELECTRICAL CHARACTERISTICS
arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range TS Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. alu 00 175 -65 to +175 arameter Thermal Resistance Junction to Ambient Air ymbo RthA i -- Forward Voltage at IF = 100mA VF -- Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
