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GMZ9.1 - SURFACE MOUNT ZENER DIODES

This page provides the datasheet information for the GMZ9.1, a member of the GMZ2.0 SURFACE MOUNT ZENER DIODES family.

Features

  • Planar Die construction.
  • 500mW Power Dissipation.
  • Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Character.

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Datasheet Details

Part number GMZ9.1
Manufacturer UPM
File Size 726.40 KB
Description SURFACE MOUNT ZENER DIODES
Datasheet download datasheet GMZ9.1 Datasheet
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UPM GMZ2.0~GMZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .079(2.0) .071(1.8) .008(0.2) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range TS Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
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