ZMM5239B Datasheet PDF

FEATURES

* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA.

MECHANICAL DATA

Case: Molded Glass MINI-MELF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.03 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .020(0.5) .012(0.3) .146(3.7) .130(3.3) .020(0.5) .012(0.3) Dimensions in millimeters

MAXIMUM RATINGS

and

ELECTRICAL CHARACTERISTICS

arameter Power Dissipation at Tamb = 25 OC ymbo PTOT Junction Temperature TJ Storage Temperature Range TS Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. alu 00 175 -65 to +175 Unit m OC OC arameter Thermal Resistance Junction to Ambie