ZMM55-C3V3 Datasheet | UPM

Features - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Pb free product are available : 99% Sn above can meet Rohsenvironment substance directive request MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI-MELF Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below Approx. Weight: 0.03 gram Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel .020(0.5) .012(0.3) .146(3.7) .130(3.3) .020(0.5) .012(0.3) Dimensions in millimeters Maximum Ratings and Electrical Characteristics arameter Power Dissipation at Tamb = 25 OC Symbo PTOT Junction Temperature Storage Temperature Range Valid provided that leads at a distance of 8mm from case are kept at ambient temperature. alue 00 175 -55 to +175 arameter Thermal Resistance Junction to Ambient Air Symbo...