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Data Sheet
SMT970
970nm High Performance TOP IR LED
Outline and Internal Circuit
(Unit : mm)
Features
• Chip Material : GaAs • Chip Dimension : 400um * 400um • Number of Chips : 1pce • Peak Wavelength : 970nm typ. • Lead Frame Die : Silver Plated on Copper • Package Resin : PA6T • Lens : Silicone or Epoxy Resin
Application
Absolute Maximum Ratings (Tc=25°C)
Item
Symbol
Ratings
Power Dissipation
PD 150
Forward Current
IF 100
Pulse Forward Current
IFP 1000
Reverse Voltage
VR 5
Thermal Resistance
Rthja
80
Junction Temperature
Tj 120
Operating Temperature
Topr
-40 ~ +100
Storage Temperature
Tstg -40 ~ +100
Soldering Temperature
TSOL
250
‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us.