DESCRIPTION
1.22 (.048) 1.66±0.08 (.065±.003) 60° 0.80 (.032) 4.00±0.08 (.156±.003) 1.80 1.80 (.071) (.071) 4.12 (.162) φ 1.50 (.059) Package Dimensions Unit: mm( inches ) 1.10 (.043) 0.75 (.030) 1.50 (.059) FEATURES
l 214.30MIN. (.563) 0.5TYP. (.020) Selected to specific on-line intensity and radiant intensity ranges l l Low cost , plastic side looking package Mechanically and spectrally matched to The MID-11422 of phototransistor . 1.0MIN. (.039) 2.54±0.08 (.100±.003) (SEE NOTE 3) C A Notes : 1. All dimensions are in millimeters.(inches). 2. Protruded resin under flange is 1.5 mm (0.059") max. 3. Lead spacing is measured where the leads emerge from the package. ABSOLUTE MAXIMUM RATINGS
@ TA=25 C Parameter Power Dissipation Peak Forward Current Continuos Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature Maximum Rating 75 1 50 5 -55 C to +100 C -55 C to +100 C 260oC for 5 seconds o o o o o Unit mW A mA V Unity Opto Technology Co., Ltd.