Description
The MSL-824TG is designed based on in an industry standard package for ease of handing and use.
The package is water clear epoxy within white plastic.
Features
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High performance Excellent chip to chip consistency High reliability
Notes : 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1 mm unless otherwise noted. A C
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Absolute Maximum Ratings @ TA=25oC
Parameter Power Dissipation Continuous Forward Current Reverse Current(VR=5V) Operating Temperature Range Storage Temperature Range
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Symbol Pad Iaf IR Topr Tstg
Maximum Rating 100 25 10
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Unit mW mA µA
-40 C to +85 C -40oC to +85oC
Lead Soldering Temperature 260 C for 5 second (.