Description
The MSL-824UG is designed based on in an industry standard package for ease of handing and use.
The package is water clear epoxy within white plastic.
Features
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High performance
A C
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Excellent chip to chip consistency High reliability
Notes : 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1 mm unless otherwise noted. l
Absolute Maximum Ratings @ TA=25oC
Parameter Power Dissipation Continuous Forward Current Reverse Current(VR=5V) Operating Temperature Range Storage Temperature Range Symbol Pad Iaf IR Topr Tstg Maximum Rating 100 35 10 -40 C to +85 C -40oC to +85oC
o o
Unit mW mA µA
Lead Soldering Temperature 260oC for 5 second (2.0m.