VTSB50X3 Datasheet | VIC

Features n Bidirectional TVS 5 V n Low capacitance - 0.3 p F n ESD protection >15 k V n Replacement for MLV (0402) n Low Clamping Voltage Applications n High Speed Line :USB1.0/2.0/3.0, VGA, DVI, HDMI n Serial and Parallel Ports n Notebooks, Desktops, Servers n Cellular handsets and accessories VTSB50X3 ----- SURFACE MOUNT TVS Diodes General Information The VTSB50X3 is designed with Vicsemi Punch-Through process TVS technology to protect voltage sensitive ponents from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space es at a premium. Also because of its low capacitance, it is suited for use in high frequency designs such as USB 2.0/3.0 high speed, VGA, DVI, HDMI and other high speed line applications. Absolute Maximum Ratings Parameter Maximum Contact discharge voltage Per IEC61000-4-2 Maximum Air discharge voltage Per IEC61000-4-2 Maximum Operating temperature Maximum Storage temperature Maximum lead temperature for soldering during 10s Symbol --- --TOPER TSTG Value 8KV 15KV -40 to +90 -55 to +125 Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Unit V V ℃ ℃ ℃ Parameter Symbol Test Conditions Reverse Working Voltage Reverse Breakdown Voltage Positive Clamping Voltage Reverse Leakage Current Junction Capacitance VRWM VBR VC IL CP Any I/O pin to GND Any I/O pin to GND IT=1m A IPP=1A，t P=8/20μ; Any I/O pin to GND VRWM =5V； Any I/O pin to GND VRWM =0V，f=1MHz； Any I/O pin to GND Min Typ Max Units --- --- 5.0 6.0 --- --- --- --- 9.5 --- --- 1.00 u A --- 0.3 --- p F - Vic Semi reserves the right to change or uprate, without notice, any information contained in this specification. .vicsemi. Page 1 of...