V50-850-C1 Overview
These pact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, and next-generation optical data munications systems. The VCSELs are contacted on the top-surface individually using...
V50-850-C1 Key Features
- 4-ch or 12 chip arrays
- Up to 56 Gbit/s per channel
- Device-to-device pitch of 250 µm
- Suitable for wire or flip-chip bonding