DGP20 Datasheet | Vaishali Semiconductor

Features - Specially designed for clamping circuits, horizontal deflection systems and damper applications - Plastic package has Underwriters Laboratory Flammability Classification 94V-0. - High temperature metallurgically bonded construction - Cavity-free glass passivated junction - 2.0 ampere operation at TA=50°C with no thermal runaway - Typical IR less than 0.1µA - Capable of meeting environmental standards of MIL-S-19500 - High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension 1.0 (25.4) min. - d e t n e t Pa 0.140 (3.6) 0.104 (2.6) Dia. 0.300 (7.6) 0.230 (5.8) ® Mechanical Data Case: JEDEC DO-204AC, molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.015 oz., 0.4 g Ratings at 25°C ambient temperature unless otherwise specified. 1.0 (25.4) min. Dimensions in inches and (millimeters) - Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306. Maximum Ratings & Thermal Characteristics Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375” (9.5mm) lead length at TA = 50°C Peak forward surge current 8.3ms single half sine wave superimposed on rated load (JEDEC Method) Maximum full load reverse current full cycle average 0.375” (9.5mm) lead length at TA = 100°C Typical thermal resistance (Note 1) Symbol VRRM VRMS VDC IF(AV) IFSM IR(AV) RΘJA TJ, TSTG CGP20 1400 980 1400 2.0 40 200 55 DGP20 1500 1050 1500 Unit V V V A A µA °C/W °C Operating junction and storage temperature range - 65 to +175 Electrical Characteristics Parameter Ratings at 25°C ambient temperature unless otherwise specified. Symbol VF IR trr trr CJ TA = 25°C TA = 100°C typical maximum CGP20 1.1 5.0 100 15 1.0 1.5 15 Unit V µA Maximum instantaneous...