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Multilayer Chip Inductors
Features
• No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow or reflow soldering • Monolithic structure for high reliability
Dimensions
SERIES L W T
Unit: mm (inch) a
W L T
0.8 ± 0.15 MLF 1608 1.6 ± 0.15 0.8 ± 0.15 (0.032 ± .006) 0.3 ± 0.2 (0603) (0.064 ± .006) (0.032 ± .006) 1.2 ± 0.2 (0.012 ± .008) (0.048 ± .008) 0.85 ± 0.2 MLF 2012 2.0 ± 0.2 1.25 ± 0.2 (0.034 ± .008) 0.5 ± 0.3 (0805) (0.080 ± .008) (0.050 ± .008) 1.25 ± 0.2 (0.020 ± .012) (0.050 ± .008) 0.6 ± 0.2 MLF 3216 3.2 ± 0.2 1.6 ± 0.2 (0.024 ± .008) 0.