BA159DGP Overview
Package 175 °C DO-204AL (DO-41) Diode variation Single die.
BA159DGP Key Features
- Superectifier structure for high reliability condition
- Cavity-free glass-passivated junction
- Fast switching for high efficiency
- Low leakage current, typical IR less than 0.1 μA
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of pliance
BA159DGP Applications
- RoHS-pliant, mercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker test Polarity
