BY251P Overview
Key Features
- Low forward voltage drop
- Low leakage current, IR less than 0.1 μA
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC DO-201AD
