Datasheet4U Logo Datasheet4U.com

BYQ28EF - Dual Common Cathode Ultrafast Rectifier

Datasheet Summary

Features

  • Power pack Available.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery times.
  • Soft recovery characteristics.
  • Low switching losses, high efficiency.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AB and ITO-220AB package).
  • AEC-Q101 qualified.
  • Material categorizatio.

📥 Download Datasheet

Datasheet preview – BYQ28EF

Datasheet Details

Part number BYQ28EF
Manufacturer Vishay Siliconix
File Size 144.35 KB
Description Dual Common Cathode Ultrafast Rectifier
Datasheet download datasheet BYQ28EF Datasheet
Additional preview pages of the BYQ28EF datasheet.

📁 Similar Datasheet

  • BYQ28EF-200 - Dual Common Cathode Ultrafast Rectifier (Vishay)
  • BYQ28E - Rectifier diodes ultrafast (NXP)
  • BYQ28E-100 - Dual Common Cathode Ultrafast Rectifier (Vishay Telefunken)
  • BYQ28E-150 - Rectifier diodes ultrafast/ rugged (NXP)
  • BYQ28E-150 - Dual Common Cathode Ultrafast Rectifier (Vishay Telefunken)
  • BYQ28E-200 - Rectifier diodes ultrafast (NXP)
  • BYQ28E-200 - Dual Common Cathode Ultrafast Rectifier (Vishay Telefunken)
  • BYQ28E-200 - Rectifier diodes ultrafast (WeEn)
  • BYQ28E-200E - Dual ultrafast power diodes (NXP)
  • BYQ28E-200E - Dual ultrafast power diodes (WeEn)
Other Datasheets by Vishay Siliconix
  • BYQ28E - Dual Common Cathode Ultrafast Rectifier

Full PDF Text Transcription

Click to expand full text
BYQ28E-xxx, BYQ28EF-xxx, BYQ28EB-xxx, UG10xCT, UGF10xCT, UGB10xCT www.vishay.com Vishay General Semiconductor Dual Common Cathode Ultrafast Rectifier TO-220AB ITO-220AB 3 2 1 BYQ28E, UG10 PIN 1 PIN 2 PIN 3 CASE TO-263AB K 123 BYQ28EF, UGF10 PIN 1 PIN 2 PIN 3 FEATURES • Power pack Available • Glass passivated pellet chip junction • Ultrafast recovery times • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AB and ITO-220AB package) • AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.
Published: |