BYV26EGP - Glass Passivated Ultrafast Rectifier

Vishay

Key Features

Superectifier structure for high reliability condition.
Cavity-free glass-passivated junction.
Ultrafast reverse recovery time.
Low forward voltage drop.
Low switching losses, high efficiency.
High forward surge capability.
Meets environmental standard MIL-S-19500.
Solder dip 275 °C max. 10 s, per JESD 22-B106.
AEC-Q101 qualified.
Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC.

BYV26EGP glass passivated ultrafast rectifier by Vishay - Datasheet Preview

Datasheet Details

Part number	BYV26EGP
Manufacturer	Vishay
File Size	76.57 KB
Description	Glass Passivated Ultrafast Rectifier
Datasheet	BYV26EGP Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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BYV26DGP, BYV26EGP Vishay General Semiconductor Glass Passivated Ultrafast Rectifier SUPERECTIFIER® DO-204AC (DO-15) PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 800 V, 1000 V IFSM 30 A trr 75 ns VF 1.3 V TJ max. 175 °C FEATURES • Superectifier structure for high reliability condition • Cavity-free glass-passivated junction • Ultrafast reverse recovery time • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max.