EGP30D
Key Features
- Superectifier structure for high reliability condition
- Cavity-free glass-passivated junction
- Ultrafast reverse recovery time
- Low forward voltage drop
- Low leakage current
- Low switching losses, high efficiency
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified
- pliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC
