ES1PB Overview
150 °C Package SMP (DO-220AA) Circuit configuration Single.
ES1PB Key Features
- Very low profile
- typical height of 1.0 mm
- Ideal for automated placement
- Glass passivated pellet chip junction
- Ultrafast recovery times for high efficiency
- Low forward voltage, low power losses
- Low thermal resistance
- Meets MSL level 1 per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
- Material categorization: for definitions of pliance please see .vishay./doc?99912
