ESH1PA - High Current Density Surface Mount Ultrafast Rectifiers
Vishay
Key Features
Reverse Voltage 50 to 200 V Forward Current 1.0 A Reverse Recovery Time 25ns
0.086 (2.18) 0.074 (1.88)
0.142 (3.61) 0.126 (3.19) 0.158 (4.00) 0.146 (3.70)
Very low profile - typical height of 1.0mm For surface mount.
Full PDF Text Transcription for ESH1PA (Reference)
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ESH1PA. For precise diagrams, and layout, please refer to the original PDF.
ESH1PA thru ESH1PD New Product Vishay Semiconductors formerly General Semiconductor High Current Density Surface Mount Ultrafast Rectifiers Cas Style SMP Cathode band Fea...
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sity Surface Mount Ultrafast Rectifiers Cas Style SMP Cathode band Features • • • • • • • • Reverse Voltage 50 to 200 V Forward Current 1.0 A Reverse Recovery Time 25ns 0.086 (2.18) 0.074 (1.88) 0.142 (3.61) 0.126 (3.19) 0.158 (4.00) 0.146 (3.70) Very low profile - typical height of 1.0mm For surface mount application Glass passivated chip junction Ultrafast recovery times for high efficiency Low forward voltage, low power loss High operation temperature up to 175°C Built-in strain relief, ideal for automated placement High temperature soldering guaranteed: 260°C/10 seconds at terminals • Meets MSL Level 1 per J-STD-020C D
ESH1PA Datasheet
