FCSP05H40ETR Overview
FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically...
FCSP05H40ETR Key Features
- Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel D