IHLM-2525CZ-01 Overview
11-May-09 For technical questions, contact:.
IHLM-2525CZ-01 Key Features
- Lowest molded height (3.0 mm) in this package footprint
- Shielded construction
- Frequency range up to 5.0 MHz
- Lowest DCR/µH, in this package size
- Handles high transient current spikes without saturation
- Ultra low buzz noise, due to posite construction
- Encapsulated body offers improved environmental protection and moisture resistance
- Higher dielectric withstanding voltage vs. IHLP
- Flame retardant encapsulant (UL 94 V-0)
- Corrosion resistant package