ILBB-0805
FEATURES
- -
- - High reliability. Surface mountable. Magnetically self shielded. Nickel barrier plating virtually eliminates silver migration.
MECHANICAL SPECIFICATIONS-
Solderability: 90% coverage after 5 second dip in 235°C solder following 60 second preheat at 120°C to 150°C and type R flux dip. Resistance To Solder Heat: 10 seconds in 260°C solder after preheat and flux per above. Terminal Strength: 0.6 kilograms (1.32 pounds) minimum for 30 seconds.
Beam Strength: 1 kilogram (2.2 pounds) minimum. Flex: 0.079” [2mm] minimum mounted on 0.063” [1.6mm] thick PC board.
ENVIRONMENTAL SPECIFICATIONS-
Operating Temperature:
- 55°C to + 125°C. Thermal Shock: 100 cycles,
- 40°C to + 125°C. Biased Humidity: 85% RH at 85°C, 1000 hours at full rated current.
STANDARD ELECTRICAL SPECIFICATIONS
Z @ 100 MHz (± 25%) 7 11 17 26 32 40 50 60 75 80 90 100 120 150 180 220 300 400 420 600 1000 1500 2000 2200 DCR MAX. (Ohms) 0.06 0.06 0.06 0.06 0.06 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.20...