SI7454DP Overview
Key Specifications
Package: SOIC
Mount Type: Surface Mount
Pins: 8
Height: 1.04 mm
Key Features
- TrenchFET® power MOSFETs
- New low package with low 1.07 mm profile
- PWM optimized for fast switching
- 100 % Rg tested
- Material categorization: for definitions of compliance please see