SMF3xA Datasheet | Vishay

Features - - - - For surface mounted applications Low-profile package e3 Optimized for LAN protection applications Ideal for ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2) - Ideal for EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4) - IEC 61000-4-2 (ESD) 15 k V (air) 8 k V (contact) - Low incremental surge resistance, excellent clamping capability - 200 W peak pulse power capability with a 10/1000 µs waveform, repetition rate (duty cycle): 0.01 % - Very fast response time - High temperature soldering guaranteed: 260 °C/ 10 seconds at terminals - Lead (Pb)-free ponent - ponent in accordance to Ro HS 2002/95/EC and WEEE 2002/96/EC Mechanical Data Case: JEDEC DO-219AB (SMF®) Plastic case Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity:The band denotes the cathode, which is positive with respect to the anode under normal TVS operation Mounting Position: Any Weight: approx. 15 mg Packaging Codes/Options: GS18 / 10 k per 13 " reel (8 mm tape), 50 k/box GS08 / 3 k per 7 " reel (8 mm tape), 30 k/box Absolute Maximum Ratings Ratings at 25 °C, ambient temperature unless otherwise specified Parameter Peak pulse power dissipation Test condition 10/1000 µs waveform1) 8/20 µs waveform Peak pulse current Peak forward surge current 1) 1) Symbol PPPM PPPM IPPM IFSM Value 200 1000 next Table 20 Unit W W A A 10/1000 µs waveform1) 8.3 ms single half sine-wave Non-repetitive current pulse and derated above TA = 25 °C Thermal Characteristics Ratings at 25 °C, ambient temperature unless otherwise specified Parameter Thermal resistance 2) Test condition Symbol Rth JA Tstg, TJ Value 180 - 55 to + 150 Unit K/W °C Operation junction and storage temperature range 2) Mounted on epoxy glass PCB with 3 x 3 mm, Cu pads ( ≥ 40 µm thick) Document Number 85811 Rev. 2.0, 29-Apr-05 .vishay. 1 SMF5V0A to SMF51A Vishay Semiconductors Electrical Characteristics Ratings at 25 °C ambient temperature unless...