TA33
FEATURES
- Center tap feature
- Resistor material: self
- passivating Tantalum Nitride
- Silicon substrate for good power dissipation
- Low cost
Actual Size
Ro HS
PLIANT
TYPICAL PERFORMANCE
These tantalum chips bine excellent stability 0.07 % (2000 hours, rated power at 70 °C) with great power handling capacity. Two bonding pads per termination allow greater flexibility in hybrid layout design.
- TCR TOL
ABS 100 ppm/°C ABS 0.5 %
TRACKING 5 ppm/°C RATIO 0.5 %
..
SCHEMATIC
R1 RT R2
RT = R1 + R2 with R1 = R2 Standard
STANDARD ELECTRICAL SPECIFICATIONS
TEST MATERIAL Resistance Range TCR: Tolerance: Tracking Absolute Ratio Absolute Matching Power Dissipation Stability Working Voltage Operating Temperature Range Storage Temperature Range Noise Thermal EMF Shelf Life Stability SPECIFICATIONS TANTALUM NITRIDE 50 ohms to 500 Kohms ± 5 ppm/°C ± 100 ppm/°C (± 50 ppm/°C on Request) 1/1 standard ± 0.5 %, ± 1 %, ± 2 % ± 0.5 % Standard 250 m W at + 25 °C, 125 m W at + 70 °C, 50 m W at + 125 °C...
