UG1C Overview
Key Specifications
Mount Type: Through Hole
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Key Features
- Glass passivated chip junction
- Ultrafast reverse recovery time
- Soft recovery characteristics
- Low forward voltage drop
- Low switching losses, high efficiency
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
