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UGF8CT - Ultrafast Rectifier

Download the UGF8CT datasheet PDF. This datasheet also covers the UGF8AT variant, as both devices belong to the same ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Glass passivated chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • High forward surge capability 2 UG8xT PIN 1 PIN 2 2 1 UGF8xT PIN 1 1.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package).
  • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC CASE PIN 2 TO-263AB K 2 1 UGB8xT PIN 1 PIN 2 K.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (UGF8AT_VishaySiliconix.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number UGF8CT
Manufacturer Vishay
File Size 175.81 KB
Description Ultrafast Rectifier
Datasheet download datasheet UGF8CT Datasheet

📁 Similar Datasheet

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UGF8CT ULTRAFAST EFFICIENT PLASTIC RECTIFIER General Semiconductor
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UGF8BT ULTRAFAST EFFICIENT PLASTIC RECTIFIER General Semiconductor
UGF8DT ULTRAFAST EFFICIENT PLASTIC RECTIFIER General Semiconductor
UGF8FT ULTRAFAST SOFT RECOVERY RECTIFIER General Semiconductor

Other Datasheets by Vishay

Part Number Description
UGF8AT Ultrafast Rectifier
UGF8BT Ultrafast Rectifier
UGF8DT Ultrafast Rectifier
UGF8FT Ultrafast Rectifier
UGF8GT Ultrafast Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
UG(F,B)8AT thru UG(F,B)8DT Vishay General Semiconductor Ultrafast Rectifier TO-220AC ITO-220AC FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability 2 UG8xT PIN 1 PIN 2 2 1 UGF8xT PIN 1 1 • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package) • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC CASE PIN 2 TO-263AB K 2 1 UGB8xT PIN 1 PIN 2 K HEATSINK TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, and other power switching application.