UH1B - Surface Mount Ultrafast Rectifiers

Datasheet Summary

Features

Low profile package.
Ideal for automated placement.
Oxide planar chip junction.
Ultrafast recovery times for high frequency.
Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AC (SMA).
Solder dip 260 °C, 40 s.
Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.

Vishay Siliconix

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Datasheet Details

Part number	UH1B
Manufacturer	Vishay Siliconix
File Size	139.56 KB
Description	Surface Mount Ultrafast Rectifiers
Datasheet	UH1B Datasheet
Additional preview pages of the UH1B datasheet.

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New Product www.datasheet4u.com UH1B, UH1C & UH1D Vishay General Semiconductor Surface Mount Ultrafast Rectifiers FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AC (SMA) • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 1.0 A TJ max. 1.0 A 100 V, 150 V, 200 V 30 A 25 ns 0.76 V 175 °C TYPICAL APPLICATIONS For use in secondary rectification and freewheeling for ultrafast switching speeds ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.

Published: Apr 10, 2009 |