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UH1B, UH1C & UH1D
Vishay General Semiconductor
Surface Mount Ultrafast Rectifiers
FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
DO-214AC (SMA)
• Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr VF at IF = 1.0 A TJ max. 1.0 A 100 V, 150 V, 200 V 30 A 25 ns 0.76 V 175 °C
TYPICAL APPLICATIONS For use in secondary rectification and freewheeling for ultrafast switching speeds ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.
UH1D Datasheet
