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New Product
UH3B, UH3C & UH3D
Vishay General Semiconductor
Surface Mount Ultrafast Rectifier
FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s
DO-214AB (SMC)
• Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPICAL APPLICATIONS For use in secondary rectification and freewheeling for ultrafast switching speeds of ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.
3.0 A
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr VF at IF = 3.0 A TJ max. 100 V, 150 V, 200 V 80 A 25 ns 0.
UH3B Datasheet
