UH6PD
Key Features
- eSMP ® Series K
- Very low profile - typical height of 1.1 mm
- Ideal for automated placement
- Oxide planar chip junction
- Ultrafast recovery times for high frequency
- Low forward voltage drop 1 2
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
- pliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC
