VESD05C-FC1 Description
Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic.
VESD05C-FC1 Key Features
- ESD protection to IEC 61000-4-2 30 kV (air)
- ESD protection to IEC 61000-4-2 8 kV (contact)
- 120 W peak pulse power dissipation per line (8/20 µs)
- Suitable for high frequency