VESD05C-FC1 Datasheet | Vishay

.. VISHAY Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic. Features - ESD protection to IEC 61000-4-2 30 k V (air) - ESD protection to IEC 61000-4-2 8 k V (contact) - ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 m A - 120 W peak pulse power dissipation per line (8/20 µs) - Suitable for high frequency applications (low capacitance, low parasitic inductance) - Low clamping voltage - Minimum PCB space needed (0.5 mm2), < 0.55 mm height, only 0.47 mg/pcs - No need for underfill material and/or additional solder - Can be assembled using standard SMT pick & place equipment, reflow processes per J-STD-020 and assembly methods - Green product Applications Cellular phones Personal digital assistants (PDA), notebook puters MP3 players GPS Digital cameras Bluetooth Audio amplifiers DVD Power management systems Read write heads for hard drives Modules for watches CPU Digital TV’s and sattelites receivers SMART cards Mechanical Data Case: Flip Chip 1005 Standard EIA chip size: 0402 8 mm tape and reel per EIA-481-1-A/IEC60286 Top contacts: 4 solder bumps 100 µm in height (nominal) Bumps of Sn Ag Cu (lead-free)1) 1) also available with Pb Sn bumps Document Number 85859 Rev. 1.1, 14-Jul-04 .vishay. 1 Data Sheet 4 U . .. Vishay Semiconductors VISHAY...