VSKJ91xxPxx Overview
The Generation 5 of ADD-A-PAK module bine the excellent thermal performance obtained by the usage of direct bonded copper substrate with superior rmechanical ruggedness, thanks to the insertion of a solid copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread. The Generation 5 of...
VSKJ91xxPxx Key Features
- High voltage
- Industrial standard package
- Thick copper baseplate
- UL E78996 approved
- 3500 VRMS isolating voltage
- Totally lead (Pb)-free
- Designed and qualified for industrial level
- Up to 1600 V
- Fully patible TO-240AA
- High surge capability
VSKJ91xxPxx Applications
- 40 to 150 kA2s kA2√s V °C A UNITS A °C
