VSKT26 Overview
The Generation 5 of modules bine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid copper baseplate at the bottom side of the device. The Cu baseplate allows an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improved thermal spread. The Generation 5 of AAP...
VSKT26 Key Features
- High voltage
- Industrial standard package
- Thick copper baseplate
- UL E78996 approved
- 3500 VRMS isolating voltage
- Totally lead (Pb)-free
- Designed and qualified for industrial level
- Up to 1600 V
- Fully patible TO-240AA
- High surge capability
VSKT26 Applications
- 40 to 125 A 2 √s V °C A2s A UNITS
