VSKUV56xxxPBF Overview
The Generation 5 of ADD-A-PAKTM module bine the excellent thermal performance obtained by the usage of direct bonded copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improved thermal spread. The Generation 5...
VSKUV56xxxPBF Key Features
- High voltage
- Industrial standard package
- Thick Al metal die and double stick bonding
- Thick copper baseplate
- UL E78996 approved
- 3500 VRMS isolating voltage
- Totally lead (Pb)-free
- Designed and qualified for industrial level
- Up to 1600 V
- Full patible TO-240AA