1N4007GP-M3
Overview
- Superectifier structure for high reliability application
- Cavity-free glass-passivated pallet chip junction
- Low forward voltage drop
- Low leakage current, typical IR less than 0.1 μA
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of compliance please see
