BU1006-E3
Overview
- UL recognition file number E309391 (QQQX2) UL 1557 (see *)
- Thin single in-line package
- Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU10065S)
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: For definitions of compliance please see
