BYG20D-HM3
Overview
- Low profile package
- Ideal for automated placement
- Glass passivated pallet chip junction
- Low reverse current
- Soft recovery characteristics
- Ultrafast reverse recovery time
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
- Material categorization: for definitions of compliance please see
