BYG22B Description
150 °C Package SMA (DO-214AC) Circuit configurations Single.
BYG22B Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low reverse current
- Low forward voltage
- Soft recovery characteristic
- Ultra fast reverse recovery time
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified available
- Automotive ordering code: base P/NHE3 or P/NHM3