CS3M Description
150 °C Package DO-214AB (SMC) Diode variations Single die.
CS3M Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak
- Material categorization: for definitions of pliance