Vishay FCSP230LTR
The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB.| Part No. | FCSP230LTR |
|---|---|
| Datasheet | FCSP230LTR Download |
| Manufacturer |  Vishay |
| Description | Chip Scale Package Schottky Barrier Rectifier |
| Buy | Stock & Price |
FEATURES
● Ultra low VF per footprint area● Low leakage
● Low thermal resistance
● One-fifth footprint of SMA
● Super low profile (0.6 mm)
● Available tested on tape and reel RoHS COMPLIANT
APPLICATIONS
● Reverse polarity protection FlipKY®● Current steering
● Freewheeling
● Flyback
● Oring
DESCRIPTION
Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency. Typical applications include hand-held, portable equipment such as cell phones, MP3 players, bluetooth, GPS, PDAs, and portable hard disk drives where space savings and performance are crucial. PRODUCT SUMMARY IF(AV) VR 1.5 A 30 V MAJOR RATINGS AND CHARACTERISTICS SYMBOL VRRM IF(AV) IFSM VF TJ 1.5 Apk, TJ = 125 °C Rectangular waveform CHARACTERISTICS MAX. 30 1.5 250 0.37 - 55 to 150 UNITS V A V...
